Workstation Forensic Technical Intake: Enterprise Workstations Target: High-Performance PC & AI Compute Systems 1. Primary Fault Classification Fault Group (A-Z) — Select Group — Compute Module & Logic (CPU/Board) Graphics Module (GPU/VRAM) Memory Module (RAM/ECC) Ports & Connectivity (IO/PCIe) Power Module (PSU/Cabling) Storage Module (NVMe/RAID) Thermal Module (Cooling/Fans) Specific Fault — Select Group First — Describe this specific issue in your own words: 2. Device Condition & PCA Utility Why we need this: We use Principal Component Analysis (PCA) to correlate your Primary AI Use Case with component fatigue. Workstations are modular; however, high-mass GPUs (like the RTX 5090) require verification against the Shield column for mm clearance to prevent motherboard torsion. Primary Professional Workflow (A-Z) LLM Training / Inference 3D Rendering / VFX Scientific Compute / Simulation Software Development Chassis & Internal Component Stability (A-Z) External Port & IO Integrity (A-Z) 3. Power Infrastructure & Modular Safety AI Technical Insight: Workstations pull massive transient loads via the **EPS12V** and **12VHPWR** connectors. If you notice “clicking” or “whining,” the modular PSU is likely suffering from capacitor aging, which prevents it from maintaining the stable voltage rails required for AI compute. Is your power cabling original or a third-party modular replacement? Original OEM ModularThird-Party CableMod/Other Are there visible signs of heat/melting on the GPU power connector? NoYes Describe the Power LED/Motherboard Post Code behavior: 4. Thermal Path & Mechanical History AI Technical Insight: Sustained AI workloads cause **Phase-Change Material (PCM) pump-out**. If your render speeds drop after 10 minutes, the thermal interface between the module and the heatsink has failed. We look for **AIO pump cavitation** (bubbling noises) which indicates fluid loss. Cooling Observations (A-Z) Normal / Quiet Loud / Constant high speed Clicking/Gurgling (Pump Failure Risk) Thermal Throttling (Speed Drops under load) Average Ambient Room Temperature during failure: 5. Previous Modular History Why we need this: Since we specialize in **Modular Swaps** and not board repair, knowing if components (RAM/GPU/SSD) were recently swapped helps us isolate **Component Handshake** failures or PCIe lane conflicts. Has this workstation been modified since the original build? NoYes List all modified modules and dates: 6. Mandatory Packaging Compliance IMPORTANT: Heavy workstations are prone to **PCIe Slot Shear** during transit. The responsibility for secure packing remains entirely with the customer. You MUST use internal expanding foam (Instapak) to brace the GPU and CPU modules. Standard bubble wrap will not prevent internal component displacement. Describe your internal bracing and external packaging method: